Product Capabilities (250 kHz – 15 MHz):
- Single element
- Multi-element (32-512 elements)
- 1d arrays (linear and curvilinear – concave and convex)
- 1.5d arrays (linear and curvilinear – concave and convex)
- 2d arrays (linear and curvilinear – concave and convex)
- High density, 1/2λ element pitch 2d arrays with >2,000 elements
- IVUS transducers
- Linear
- End-fire
- Ring
- Hemispheric >10,000 elements
- Ring Arrays (1024-4096 elements, 100-300mm diameter)
- 1-3 composite fabrication (1-10 MHz)
- Custom acoustic material formulation (Front and back matching plates, backing absorbers)
- Piezoelectric material (high density, high dielectric PZT and single crystal PMN-PT type materials)
- Parylene coating
- Wafer/fine scale dicing
- Metal evaporation and sputtering
- CNC machining and profiling within micron range
- Wire and plunge EDM
- High density interconnect
- 40-52 awg coaxial wires/cables
- Fine line flexible circuit (25/25 lines and spaces)
- Rapid prototyping and soft tool molding of parts
Design Tools: Mechanical Design:
- Solidworks CAD
- Transducer modeling software
- KLM Modeling
- FEA Modeling
- Impedance – gain phase analyzer
- High voltage impulse pulsar
- Acoustic tanks
- Sound field measurements
- High power microscopes