Processes


1-3 composite fabrication (1-10 MHz)

Custom acoustic material formulation (Front and back matching plates, backing absorbers)

Piezoelectric material (high density, high dielectric PZT and single crystal PMN-PT type materials)

Parylene coating

Wafer/fine scale dicing

Metal evaporation and sputtering

CNC machining and profiling within micron range

Wire and plunge EDM

High density interconnect

  • 40-52 awg coaxial wires/cables
  • Fine line flexible circuit (25/25 lines and spaces)

Rapid prototyping and soft tool molding of parts

 

*Please email info@covarx.com for inquiries on specific processes.