Capabilities

 

Product Capabilities (250 kHz – 15 MHz):

  • Single element
  • Multi-element (32-512 elements)
    • 1d arrays (linear and curvilinear – concave and convex)
    • 1.5d arrays (linear and curvilinear – concave and convex)
    • 2d arrays (linear and curvilinear – concave and convex)
  • High density, 1/2λ element pitch 2d arrays with >2,000 elements
  • IVUS transducers
    • Linear
    • End-fire
    • Ring
  • Hemispheric >10,000 elements
  • Ring Arrays (1024-4096 elements, 100-300mm diameter)

Process Capabilities:

  • 1-3 composite fabrication (1-10 MHz)
  • Custom acoustic material formulation (Front and back matching plates, backing absorbers)
  • Piezoelectric material (high density, high dielectric PZT and single crystal PMN-PT type materials)
  • Parylene coating
  • Wafer/fine scale dicing
  • Metal evaporation and sputtering
  • CNC machining and profiling within micron range
  • Wire and plunge EDM
  • High density interconnect
    • 40-52 awg coaxial wires/cables
    • Fine line flexible circuit (25/25 lines and spaces)
  • Rapid prototyping and soft tool molding of parts

Design Tools: Mechanical Design:

  • Solidworks CAD
  • Transducer modeling software
    • KLM Modeling
    • FEA Modeling

Test and Evaluation Systems:

  • Impedance – gain phase analyzer
  • High voltage impulse pulsar
  • Acoustic tanks
  • Sound field measurements
  • High power microscopes